Title:
改善された性能を有する切削液
Document Type and Number:
Japanese Patent JP2013507488
Kind Code:
A
Abstract:
The cutting of semiconducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.
Inventors:
You Wanglin
Daniel A. Aguilar
John Bee Cuthbert
Chewy-pin
Daniel A. Aguilar
John Bee Cuthbert
Chewy-pin
Application Number:
JP2012533451A
Publication Date:
March 04, 2013
Filing Date:
October 16, 2009
Export Citation:
Assignee:
Dow Global Technologies LLC
International Classes:
C08L71/02; B24B27/06; B28D5/04; B28D7/02; C08L33/02; C10M105/14; C10M105/24; C10M105/26; C10M105/72; C10M107/34; C10M173/02; C10M177/00; H01L21/304; C10N20/04; C10N40/22
Domestic Patent References:
| JP2001192646A | 2001-07-17 | |||
| JP2006111728A | 2006-04-27 | |||
| JPH10259395A | 1998-09-29 | |||
| JP2002537440A | 2002-11-05 | |||
| JP2011518915A | 2011-06-30 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Naori Kota
Takashi Ishida
Tetsuji Koga
Yoshihiro Kobayashi
Satoshi Deno
Naori Kota