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Title:
CUTTING MACHINE
Document Type and Number:
Japanese Patent JP2004345040
Kind Code:
A
Abstract:

To irradiate an upper surface of a cutting material with laser radiation irradiated from a laser oscillator, even when the upper surface of the cutting material is directed to an opposite side of the laser oscillator.

A supporting member 32 is fixed to a holder 5. The laser oscillator 30 is provided to be horizontally movable in a front and rear direction on the supporting member 32. When a cutting blade part 8 is located at an upper limit position, a part or all of laser radiation L passes a lower side of a cutting blade 10. The upper surface of the cutting material 41 is irradiated with the laser radiation L without being hindered by the cutting blade 10 or being in the shadow of the cutting material 41.


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Inventors:
TERAJIMA HIDEAKI
Application Number:
JP2003145694A
Publication Date:
December 09, 2004
Filing Date:
May 23, 2003
Export Citation:
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Assignee:
HITACHI KOKI KK
International Classes:
B23D47/00; B23D45/16; B23D53/12; B23D55/00; B27B9/00; (IPC1-7): B23D47/00; B23D45/16; B23D53/12; B23D55/00; B27B9/00



 
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