To correspond to the cutting of the outer peripheral part of a larger columnar silicon ingot and the reduction of cutting chips by stably rotationally driving a thin-walled outer peripheral blade saw of a large diameter without causing run-out.
This cutting machine is equipped with an outer peripheral blade saw 81 rotationally driven by the rotary motor of a cutting mechanism 80 to cut the outer peripheral part of a work W1 and the run-out suppressing mechanism (sub-chuck 63, a cover member 83, liquid pressure supply pipe 84, a liquid pressure introducing chamber and a liquid pressure stabilizing member) provided to the cutting mechanism 80 and a slider mechanism 50 and suppressing the run-out at the time of rotational driving of the outer peripheral blade saw 81. By this constitution, the run-out of the outer peripheral blade saw 81 can be suppressed even if the outer peripheral blade saw 81 is made large in diameter and reduced in thickness to correspond to the cutting of the outer peripheral part of the work W1 of a larger diameter and the reduction of the cutting chips. Further, since the work W1 is moved by the slider mechanism 50 moving along the longitudinal direction of a base stand, the cutting machine can correspond to the cutting of the outer peripheral part of the longer work W1.
| JPS63212470 | ID BLADE |
| JP3293930 | SEMICONDUCTOR DICING METHOD |
ITO HIROYUKI
| JP2010083743A | 2010-04-15 | |||
| JPS6063110A | 1985-04-11 | |||
| JPH0236653Y2 | 1990-10-04 | |||
| JPS5243192A | 1977-04-04 |
Yoshitaka Kozuka
Akiko Tsutsui
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