To reduce the depth of a working-altered layer of the cut surface of a work (wafer) without impairing the cutting efficiency.

In this cutting method, a cylindrical work 1 is cut while the cylindrical work 1 is pressed against a wire 4 running at high speed, and slurry 3 containing abrasive grains are fed to the wire 4. As the abrasive grains contained in the slurry 3, the abrasive grains in which a mixing ratio of the abrasive grains with an average particle size of 10 to 30 μm to the abrasive grains with an average particle side of 0.1 to 2 μm is 8:2 to 3:7, are used.