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Title:
CUTTING METHOD AND CUTTING DEVICE OF LAMINATED SHEET WITH ADHESIVE LAYER
Document Type and Number:
Japanese Patent JP2016147362
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method which can repeatedly and stably cut a laminated sheet with an adhesive layer.SOLUTION: A cutting method includes: a peeling process of peeling a peeling layer 103 from a laminated sheet 100 having a base material 101, an adhesive layer 102, and the peeling layer 103 in this order, exposing the adhesive layer 102, and feeding the laminated sheet 100 with the peeling layer 103 peeled off to cutting blades 41, 51; a cutting process of cutting with the cutting blade 41 positioned on an adhesive layer 102 side and separating a laminated sheet piece 105 from the laminated sheet 100; and a separating process of separating the laminated sheet 100 adhering to the cutting blade 41 from the cutting blade 41 after cutting.SELECTED DRAWING: Figure 8

Inventors:
TAKANO MASATO
Application Number:
JP2015026939A
Publication Date:
August 18, 2016
Filing Date:
February 13, 2015
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B26D7/18; B26D1/08; B26D3/00; B65H35/06; B65H41/00
Domestic Patent References:
JPS62175382A1987-08-01
JP2004010320A2004-01-15
JP2007061930A2007-03-15
JP2004298989A2004-10-28
JP2011230230A2011-11-17
JP2003025274A2003-01-29
JP2006175535A2006-07-06
JP2011077443A2011-04-14
Foreign References:
WO2011158476A12011-12-22
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Yukihiro Hotta
Kuno Yoshifumi