Title:
CUTTING METHOD AND DEVICE FOR SEMICONDUCTOR WAFER PROTECTIVE FILM
Document Type and Number:
Japanese Patent JP2004025438
Kind Code:
A
Abstract:
To provide a method and device for cutting a protective film exactly according to the shape of a semiconductor wafer.
The semiconductor wafer W having a circumferential part is put on a table 201, and the protective film 109 is stuck on the surface of the semiconductor wafer W. The protective film 109 is cut with a cutter 301 according to the shape of the semiconductor wafer W. The cutter 301 is arranged so as to incline to the side of the semiconductor wafer W. When the table 201 is rotated to cut the protective film 109 along the circumferential part, the protective film 109 does not project from the peripheral edge of the semiconductor wafer. An inclination angle of the cutter 301 can be adjusted.
Inventors:
SAITO HIROSHI
KURITA TAKESHI
OKAMOTO KOJI
KURITA TAKESHI
OKAMOTO KOJI
Application Number:
JP2003171801A
Publication Date:
January 29, 2004
Filing Date:
June 17, 2003
Export Citation:
Assignee:
LINTEC CORP
International Classes:
B26D3/00; B26D5/00; H01L21/304; (IPC1-7): B26D5/00; B26D3/00; H01L21/304
Attorney, Agent or Firm:
Takashi Matsuura