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Title:
CUTTING METHOD AND CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2018118371
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To make it possible to perform cutting, which is performed by rotating also a round piece chip while rotating a cylindrical work-piece, for also an inner periphery of the work-piece and to assure a high tolerance.SOLUTION: A method for cutting an inner peripheral surface 8 of a rotating cylindrical work-piece 7 by a linear tool 20 to a tip 21 of which a round piece chip 30 is attached. According to this method, the work-piece 7 is gripped by a chuck device 14 in the state that a side face 9 on an axial direction one side S1 of the work-piece 7 is brought into contact with a contact face 42 on the chuck device 14 side. A cross angle B of a rotation center line Cx of the work-piece 7 and a virtual straight line L which is parallel to an axis Cz of the round piece chip 30 and crosses the rotation center line Cx is so made as to be less than 45 degrees. A feed direction of the round piece chip 30 with respect to the inner peripheral surface 8 of the work-piece 7 is so made as to be a direction toward the axial direction one side S1 from an axial direction other side S2 of the work-piece 7, and the inner peripheral surface 8 of the work-piece 7 is cut by the round piece chip 30 which rotates around the axis Cz.SELECTED DRAWING: Figure 1

Inventors:
YOKOYAMA KOJI
NARISAWA MASAMI
KUROYANAGI SHOGO
SHICHIRI YOSHINOBU
Application Number:
JP2017216520A
Publication Date:
August 02, 2018
Filing Date:
November 09, 2017
Export Citation:
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Assignee:
JTEKT CORP
International Classes:
B23B1/00; B23B5/00; B23B27/08
Domestic Patent References:
JPS5851003A1983-03-25
JPS58143908A1983-08-26
JPS60161011A1985-08-22
JP2012202281A2012-10-22
Attorney, Agent or Firm:
Patent Business Corporation Suncrest International Patent Office