Title:
多孔質炭素基材の裁断方法
Document Type and Number:
Japanese Patent JP7087528
Kind Code:
B2
Abstract:
To provide a method for cutting a porous carbon substrate in sheet form, with chips being suppressed from remaining.SOLUTION: A method for cutting a porous carbon substrate comprises cutting a porous carbon substrate CS in sheet form including carbon fiber bonded with resin carbide on a cutting table 114. The cutting table 114 has an air suction mechanism for sucking air from the top face 114a in contact with the porous carbon substrate CS. While sucking air by the air suction mechanism, the porous carbon substrate CS is cut on the cutting table 114.SELECTED DRAWING: Figure 1
Inventors:
Hiroto Tatsuno
Application Number:
JP2018056567A
Publication Date:
June 21, 2022
Filing Date:
March 23, 2018
Export Citation:
Assignee:
Mitsubishi Chemical Corporation
International Classes:
D06H7/02; H01M4/88; H01M4/96; H01M8/18
Domestic Patent References:
| JP2016139495A | ||||
| JP2016091997A | ||||
| JP2009083310A | ||||
| JP2015096464A | ||||
| JP2011065926A | ||||
| JP2008087130A |
Attorney, Agent or Firm:
田▲崎▼ 聡
Shunsuke Fushimi
Kazunori Onami
Shunsuke Fushimi
Kazunori Onami