Title:
CUTTING METHOD OF SUBSTRATE
Document Type and Number:
Japanese Patent JP2023023263
Kind Code:
A
Abstract:
To provide a cutting method of a substrate in which processing can be excellently done in step cut.SOLUTION: A cutting method of substrate in which a substrate is cut along scheduled division lines by a cutting blade having a cutting blade on which abrasive grains are fixed by a holding material comprises: a first cutting step 1002 of forming a first cut groove by a first cutting blade along scheduled division lines from a front side of the substrate; and a second cutting step 1003 of cutting into the first cut groove from a front side of the substrate by a second cutting blade with a thinner cutting blade than the first cutting blade, from a groove bottom of the first cut groove, and forming a second cut groove extending toward a rear face of the substrate. The cutting blade of the first cutting blade has a central layer and outer layers which are laminated bilaterally symmetrically on both sides of the central layer in a thickness direction from the central layer, where the central layer has a smaller wear amount than the outer layer.SELECTED DRAWING: Figure 5
Inventors:
AYAGAKI TAKASHI
Application Number:
JP2021128588A
Publication Date:
February 16, 2023
Filing Date:
August 04, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B27/06; B24B19/02; B24D3/00; B24D5/12; B24D5/14; H01L21/301
Attorney, Agent or Firm:
Sakai International Patent Office