Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CUTTING METHOD USING WIRE SAW
Document Type and Number:
Japanese Patent JP2006224346
Kind Code:
A
Abstract:

To provide a cutting method using a wire saw capable of achieving the shortening of a cutting time without lowering the cutting efficiency of the wire saw even in a case that a material part having higher hardness is contained in a part of the cutting surface of a cutting target.

A through-hole 2 is formed to the cutting target so as to divide the cutting scheduled surface 1 set to the cutting target into a plurality of parts and the wire saw 3 is inserted in the through-hole 2 while the wire saw 3 exposed from the through-hole 2 is stretched over a running auxiliary device 4 in a runnable manner so as to go toward the outer edge of the cutting scheduled surface 1. The wire saw 3 is driven and run to cut a plurality of dividing and cutting scheduled surfaces 1a and 1b in parallel by the range 3a of the wire saw exposed from the through-hole 2 and the range 3b of the wire inserted in the through-hole 2 to cut the cutting target.


Inventors:
ITO AKIRA
Application Number:
JP2005038213A
Publication Date:
August 31, 2006
Filing Date:
February 15, 2005
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TAISEI CORP
International Classes:
B28D1/08; E04G23/08
Domestic Patent References:
JPH1190921A1999-04-06
JPH06159000A1994-06-07
JP2002327543A2002-11-15
JPH01112247U1989-07-28
Attorney, Agent or Firm:
Sakuo Yamaguchi