Title:
CUTTING METHOD OF WAFER
Document Type and Number:
Japanese Patent JPS5917264
Kind Code:
A
Abstract:
PURPOSE:To prevent a pellet from adhesion of scraps or contamination on the surface by a method wherein after the wafer is made in the freezed condition by water or a coolant and is cut, the wafer is thawed and divided into the pellets. CONSTITUTION:A wafer 6 is completed with disposal of the previous process of preliminary formation of a semiconductor circuit element, etc., the wafer is freezed to be fixed on a wafer supporting plate 4 in the condition as to surround completely the circumference of the wafer with a freezed layer 5 of pure water, for example, and the wafer supporting plate 4 thereof is put on the suction head 2 of a dicer. The back of the wafer supporting plate 4 is sucked to be fixed on the suction head 2 through a vacuum suction path 3 from a vacuum source. Thereupon the wafer 6 is also fixed on the suction head 2 through the wafer supporting plate 4. After then, for positioning of the cutting position of the wafer 6, positioning in the X-Y directions of the base 1 of the dicer is performed, and the wafer 6 is cut from the X-Y directions by the high speed rotation of a dicing saw 7. Accordingly, the wafers 6 are freezed to be fixed on the wafer supporting plate 4 being held mutually in the prescribed line up position as they are by the freezed layers 5 on the lower face side even in the condition of the pellets 6a after cut completely by the dicing saw 7.
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Inventors:
KAGEYAMA JIYOUICHIROU
Application Number:
JP12578582A
Publication Date:
January 28, 1984
Filing Date:
July 21, 1982
Export Citation:
Assignee:
HITACHI LTD
HITACHI YONEZAWA DENSHI KK
HITACHI YONEZAWA DENSHI KK
International Classes:
H01L21/301; H01L21/304; (IPC1-7): H01L21/78
Attorney, Agent or Firm:
Toshiyuki Usuda