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Title:
CUTTING METHOD
Document Type and Number:
Japanese Patent JP2012106325
Kind Code:
A
Abstract:

To provide a cutting method in which a laser beam is efficiently utilized to process a work material.

In the cutting method, a work 1 is processed in a predetermined shape by a cutting tool 4 which abuts on the work 1 and cuts the work 1. In a cutting process for cutting the work 1 by the cutting tool 4, the strength of the work 1 is lowered by condensing and irradiating the laser beam on a sheared surface SP of the work 1 and heating. Thereby, the laser beam is locally condensed and irradiated on the sheared surface SP of the work 1. Therefore, an increase of an energy amount required for the laser beam can be suppressed and the strength of the work 1 is lowered to reduce cutting resistance in cutting work. Accordingly, the laser beam can be utilized efficiently in the cutting work to process the work 1.


Inventors:
HORI KANTARO
INOMATA SUMITOMO
OBA YASUHIRO
KAWAMOTO YASUNORI
KANO FUMIYOSHI
KOJIMA HISATOSHI
Application Number:
JP2010258975A
Publication Date:
June 07, 2012
Filing Date:
November 19, 2010
Export Citation:
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Assignee:
DENSO CORP
International Classes:
B23B1/00
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office