Title:
CUTTING METHOD
Document Type and Number:
Japanese Patent JP2022144941
Kind Code:
A
Abstract:
To prevent an end material chip from scattering without forming a non-cutting region, and to singulate a workpiece to a plurality of device chips.SOLUTION: A cutting method for cutting a workpiece having a device region and an outer peripheral region on a front surface side includes: a holding step of holding the workpiece with a holding table via a dicing tape; a first cutting step of removing an end material chip containing region with a predetermined length from an outer peripheral edge in the outer peripheral region by rotating the holding table in a state where, after the holding step, a first cutting blade is cut into the outer peripheral region of the workpiece to a depth where the lower end of the first cutting blade reaches the dicing tape; and a second cutting step of cutting the workpiece along each cutting schedule line in a state where, after the first cutting step, a second cutting blade is cut into the workpiece to the depth where the lower end of the second cutting blade reaches the dicing tape.SELECTED DRAWING: Figure 6
Inventors:
KOBA MITSUHIKO
MASUNAGA MAKOTO
MASUNAGA MAKOTO
Application Number:
JP2021046146A
Publication Date:
October 03, 2022
Filing Date:
March 19, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/301; B24B27/06; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Previous Patent: Conveyor
Next Patent: Decorative board and method for manufacturing decorative board
Next Patent: Decorative board and method for manufacturing decorative board