Title:
CUTTING METHOD
Document Type and Number:
Japanese Patent JP3751121
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the method capable of cutting brittle materials such as glass and semiconductor wafer with high machining precision.
SOLUTION: The top end of a crack CR growing on a material is imaged during cutting, with the position of the tip end recognized by the image processing. On the basis of the positional information of the tip end of the crack, a distance is determined for example between the tip end of the crack and the center of the heat source H, with the moving quantity of the heat source corrected during the machining so that the distance becomes constant. In addition, if the deviation of a crack CR growth is found against the planned cutting line based on the positional information by the image processing, the moving route of the heat source H is corrected to eliminate the deviation, thereby enabling the crack growth to develop in an always satisfactory state.
Inventors:
Morita Hideki
Toshihiro Okiyama
Hideyuki Shirahama
Katsuyuki Mitsutake
Onita Hidenobu
Tomohiro Suenaga
Koichi Kinoshita
Shunichi Maekawa
Toshihiro Okiyama
Hideyuki Shirahama
Katsuyuki Mitsutake
Onita Hidenobu
Tomohiro Suenaga
Koichi Kinoshita
Shunichi Maekawa
Application Number:
JP16847797A
Publication Date:
March 01, 2006
Filing Date:
June 25, 1997
Export Citation:
Assignee:
Nagasaki Prefecture
Japan Science and Technology Agency
Japan Science and Technology Agency
International Classes:
B23K26/40; B26F3/16; B23K26/00; B23K26/02; B23K26/08; B23K26/38; B28D5/00; (IPC1-7): B23K26/00; B23K26/00; B23K26/02; B23K26/08; B26F3/16; B28D5/00
Domestic Patent References:
| JP9001370A |
Attorney, Agent or Firm:
Yoshiro Kurauchi