To eliminate the removing work of an adherent wax remaining in respective grooves which are provided on the affixing surface of a jig, and in addition, surely prevent chippings on a block from generating when each chip is cut out by applying a cutting process on each block being cut out from a wafer.

A solid adherent wax is dissolved with a volatile organic solvent to make a liquid adhesive, and after applying the liquid adhesive on an affixing surface 34a of a jig 34, a low bar 42 is mounted on the applicable affixing surface 34a. At the same time, the applied liquid adhesive is heated, and the low bar 42 is bonded and fixed.