Title:
CUTTING PATH GENERATION DEVICE AND CUTTING PATH GENERATION METHOD
Document Type and Number:
Japanese Patent JP2022015241
Kind Code:
A
Abstract:
To suppress the vibration of a work material and a deformation of the work material due to the vibration in the case of cutting the work material with low rigidity.SOLUTION: A cutting path generation device includes: a temporary machining path search unit that searches for temporary machining paths based on work material information including a shape of a work material and tool information; a characteristics estimation unit that estimates characteristics of the work material based on the work material information and also estimates the direction of cutting force applied to the work material in the temporary machining path based on the work material information and the tool information; and an evaluation unit that evaluates the temporary machining path based on the relationship between the estimated characteristics of the work material and the cutting force direction.SELECTED DRAWING: Figure 1
Inventors:
YAMADA YU
KAMISHIRO YOSHITAKA
ESUMI MASAKUNI
UCHIUMI KOJI
KAMISHIRO YOSHITAKA
ESUMI MASAKUNI
UCHIUMI KOJI
Application Number:
JP2020117951A
Publication Date:
January 21, 2022
Filing Date:
July 08, 2020
Export Citation:
Assignee:
HITACHI LTD
International Classes:
G05B19/4069; B23Q15/00
Attorney, Agent or Firm:
Shoyo domestic and overseas patent office
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