PURPOSE: To slice a semiconductor ingot having a larger caliber without increasing the diameter of a cutter blade.

CONSTITUTION: A hole 6a is axially bored in the center part of a semiconductor ingot 6 to be cut to be filled with an adhesive 10 and this semiconductor ingot 6 is positioned within the central circular hole 3a provided at the center of a cutter blade 3 rotating at a high speed to be sent under rotation. By this constitution, the semiconductor ingot 6 is sliced by the inner blade 3b provided to the inner peripheral part of the circular hole 3a. Since the semiconductor ingot 6 can be cut by the cutter blade 3 wherein the distance from the inner blade 3b to the outer periphery thereof is slightly larger than the radius of the semiconductor ingot 6, the semiconductor ingot 6 having a large caliber can be cut without increasing the diameter of the cutter blade 3.