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Patent Searching and Data

Document Type and Number:
Japanese Patent JP2004188525
Kind Code:

To machine a flank of a cutting tool having a round edge precisely to the nano-meter order.

A lapping machine fixing base 10 is tiltably installed on a column 2. The lapping machine fixing base 10 is tilted to the clearance angle of the cutting tool having the round edge. On a rotary table 4 on an XY table 3, a cutting tool installation and fixing base 6 is installed through a micro-motion device 5. A rake face of the cutting tool installed on the cutting tool installation fixing base 6 is disposed on an upper surface. Using a microscope 30, and driving the device 5, the center of the edge of the cutting tool is deflected from the rotation center of the rotary table 4 by size of roundness (arc radius) of the round edge. The edge of the cutting tool is pressed to the lapping machine 13, and the lapping machine 13 is rotated, while the rotary table is rotated to reciprocate. In the edge of the cutting tool, a conical flank is formed with a desired clearance angle in the round edge. Machining with an NC device can thus be conducted in simple constitution. The round edge can be easily machined at high precision to the nano-meter order.

Sawada, Kiyoshi
Yabaneta, Yoshikazu
Application Number:
Publication Date:
July 08, 2004
Filing Date:
December 10, 2002
Export Citation:
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International Classes:
B24B3/34; (IPC1-7): B24B3/34
Attorney, Agent or Firm:
杉山 秀雄
湯田 浩一
竹本 松司
魚住 高博