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Title:
CUTTING TOOL AND CUTTING METHOD FOR PULLED SINGLE CRYSTAL SEED PRESSING PART USING THE SAME
Document Type and Number:
Japanese Patent JPH05277825
Kind Code:
A
Abstract:

PURPOSE: To provide a cutting tool by which a material to be cut is cut in its state being sandwiched.

CONSTITUTION: Heat resisting rubber boards 8, 9 are respectively fixed on the upper faces of the fixed blade 1 and the movable blade 2 of a pair of shears for cutting fruit, the rubber board 8 is made to project from a blade tip 3 to the blade tip 4 side of the movable blade 2, and the rubber board 9 is made to project from the blade tip 4 to the blade tip 3 side of the fixed blade 1. In the case of recovering Si single crystal obtained by CZ method, the use of the shears enables to cut a seed processing part 32, while a part of the seed pressing part sandwiched so that safe and reliable recovery works of Si single crystal can be performed without any trouble such as bounce of a wire for pulling up Si single crystal.


Inventors:
Hidetoshi Seki
Masumi Honda
Application Number:
JP10555792A
Publication Date:
October 26, 1993
Filing Date:
March 31, 1992
Export Citation:
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Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B23D29/02; B23D35/00; C30B15/00; (IPC1-7): B23D29/02; B23D35/00; C30B15/00
Attorney, Agent or Firm:
Koichi Tateno



 
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