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Title:
CUTTING TOOL FOR PATTERN PROCESSING, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2013248726
Kind Code:
A
Abstract:

To provide a cutting tool for pattern processing, configured to be mounted to secure strength and durability, even when used for a long period of time.

A cutting tool for pattern processing includes: a tool body having a predetermined diameter and length, and rotating around a center shaft as a rotating shaft; at least three flanks being cut to the center shaft by a clearance angle having a predetermined inclination to the direction of the center shaft of the tool body at a predetermined position of an outer peripheral surface of the tool body; and a tool edge with both sides of the flank playing a role of the cutting blade for processing a material to be cut.


Inventors:
HWANG SEON GYU
KIM TO U
Application Number:
JP2013061799A
Publication Date:
December 12, 2013
Filing Date:
March 25, 2013
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
B23C5/10
Domestic Patent References:
JP2001162429A2001-06-19
JPH04269111A1992-09-25
JP3161423U2010-07-29
JP2004345031A2004-12-09
JPS5315190U1978-02-08
JPS479431Y11972-04-10
Attorney, Agent or Firm:
Kyosei International Patent Office