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Patent Searching and Data


Title:
CUTTING TOOL POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH01146649
Kind Code:
A
Abstract:

PURPOSE: To grind a tool cutting edge with high precision, by a method wherein a control means to control relative position between the cutting edge of a cutting tool held by a holding part and a grinding tray is provided, a measuring device to measure the shape precision of the cutting edge to be polished is situated on a machine, and unevenness in polishing efficiency is suppressed.

CONSTITUTION: In order to suppress deterioration of cutting edge shape precision due to difference in polishing efficiency due to anisotropy of a diamond impeding cutting edge shape precision, the cutting edge of a diamond bite 3 is forcibly pressed against a polishing tray 1a in a first process. Through rotation rocking of a hold arm 4, a relative position between a diamond and a polishing tray 1a is controlled, and through integration of a plurality of fine polishing planes, a molding work is applied on the cutting edge to form a polygonal shape similar to an arc of a circle. The shape of the cutting edge is measured by a measuring device 9 on a machine, a polishing amount of the fine polishing surface is grasped, and based on the measurement, the similar polygonal shape is corrected to a similar shape to that of an arc of a circle with high precision. Thereafter, the cutting edge is formed in the arcuate shape of a round by means of a polishing tray 1b.


Inventors:
NISHIGUCHI TAKASHI
KONDO MASAKAZU
Application Number:
JP30560987A
Publication Date:
June 08, 1989
Filing Date:
December 04, 1987
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B24B3/34; (IPC1-7): B24B3/34
Domestic Patent References:
JPS56157937A1981-12-05
JPS5620199U1981-02-23
JP40022108A
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)