CUTTING TOOL FOR SEMI-CONDUCTOR PACKAGE

Title:

CUTTING TOOL FOR SEMI-CONDUCTOR PACKAGE

Document Type and Number:

Japanese Patent JP2004330214

Kind Code:

A

Abstract:

To provide a cutting tool capable of obtaining practically sufficient tool lifetime without any difficult grinding even when simultaneously cutting seal resin and a lead containing silica particles.

In a punch 50 and a die 52 to simultaneously cut a seal resin 24 and a lead 22 containing silica particles present in a peripheral edge part of a semiconductor package 20, diamond hard films 62 and 64 having a film thickness of about 12 μm by laminating fine crystal diamond of the crystal grain size of ≤ 2 μm thereon are provided on surfaces of the punch and the die. Surface roughness is enhanced in comparison with that of a regular diamond hard film, and the punch 50 and the die 52 can be used in cutting the semi-conductor package 20 without any difficult grinding, and the manufacturing cost of the punch and the die is considerably reduced.

More Like This:

JP2575841	[Name of device] Press type
JPH07164058	SHEET BENDING MACHINE AND METHOD FOR USING IT

Inventors:

OSADA TAKEHIRO
UESAWA YUICHI
KUBOTA KYUZO
KASAI KEIICHI
SAKAMOTO TOMOO
IWAMOTO KOJI
HANIYU HIROYUKI
FUKUI YASUO

Application Number:

JP2003125764A

Publication Date:

November 25, 2004

Filing Date:

April 30, 2003

Export Citation:

Click for automatic bibliography generation Help

Assignee:

APIC YAMADA CORP
OSG CORP

International Classes:

B21D28/00; B21D37/01; B21D37/20; (IPC1-7): B21D28/00; B21D37/01; B21D37/20

Attorney, Agent or Firm:

Haruyuki Ikeda

Previous Patent: FURNACE COILER OF STECKEL MILL ROLLING EQUIPMENT

Next Patent: METHOD FOR DRYING RAW MATERIAL GYPSUM