Title:
切削工具
Document Type and Number:
Japanese Patent JP7046802
Kind Code:
B2
Abstract:
A cutting tool according to one aspect of the present disclosure includes a substrate and a diamond layer coating the substrate. A cutting tool according to one aspect of the present disclosure includes a rake face, a flank contiguous to the rake face, and a cutting edge configured by a ridge formed by the rake face and the flank. The rake face has a first rake face and a second rake face located between the first rake face and the flank. The second rake face and a surface of the substrate located on the side of the rake face form a negative angle. The second rake face is formed at the diamond layer.
Inventors:
Yutaka Kobayashi
Katsuo Kazehaya
Katsuo Kazehaya
Application Number:
JP2018524918A
Publication Date:
April 04, 2022
Filing Date:
April 27, 2017
Export Citation:
Assignee:
Sumitomo Electric Hardmetal Corp.
International Classes:
B23B27/00; B23B27/14; B23B27/20; B23C5/10; B23C5/16
Domestic Patent References:
| JP2109608A | ||||
| JP2008100300A | ||||
| JP5499771B2 |
Attorney, Agent or Firm:
Fukami patent office
Previous Patent: Eyeglass lens
Next Patent: Semiconductor laser equipment, semiconductor laser modules and laser light source systems for weldin...
Next Patent: Semiconductor laser equipment, semiconductor laser modules and laser light source systems for weldin...