Title:
CUTTING AND TRANSPORTING METHOD OF LAMINATED SYNTHETIC RESIN PLATE AND DEVICE THEREFOR
Document Type and Number:
Japanese Patent JP2007001718
Kind Code:
A
Abstract:
To provide a method and device for cutting a number of strip-shaped synthetic resin plates formed by laminating using sticking agent upon laying in line followed by a process of stocking them, in which such an occurrence is precluded at the time of stocking that the sticking agent used in manufacturing chips ranges out of the end faces of the chips after cutting to result in sticking together of adjoining chips.
Chips C as product from cutting are attracted by pressure independently by a pneumatic decompressing suction cup or a sticking board 16, and individual chips C are put repellency to adjoining rectangular chips, and the separated chips C are stacked one by one in stock parts 31 provided independently for respective rows.
Inventors:
Mizuno, Kiyoshi
Application Number:
JP2005000183509
Publication Date:
January 11, 2007
Filing Date:
June 23, 2005
Export Citation:
Assignee:
SANZEN KAKO KK
International Classes:
B65G57/26; B26D7/32; B65G57/04; B65G57/02; B26D7/00