Title:
円筒研削機及びインゴットの円筒研削方法
Document Type and Number:
Japanese Patent JP5533012
Kind Code:
B2
Abstract:
A cylindrical grinder is disclosed that includes a support unit including an upper support device and a lower support device, in which an ingot of silicon single crystal is interposed in a direction of axis line between the upper support device and the lower support device and is clampingly held to be rotated around the axis line, and a grinding unit that relatively moves along the direction of axis line of the ingot to traverse grind an outer circumference of the ingot. The upper support device is placed at an upper position and the lower support device is placed at a lower position, so that the support unit clampingly holds the ingot in a state in which the direction of the axis line of the ingot is disposed along a vertical direction.
Inventors:
Ryoichi Kaito
Application Number:
JP2010036452A
Publication Date:
June 25, 2014
Filing Date:
February 22, 2010
Export Citation:
Assignee:
Sumco inc.
International Classes:
B24B5/04; B24B41/06
Domestic Patent References:
| JP2009190142A |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Yasuhiko Murayama
Tadashi Takahashi
Yasuhiko Murayama