Title:
CYLINDRICAL SPUTTERING TARGET AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015183284
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a plurality of long-sized cylindrical division targets that suppress an abnormal discharge (arcing) caused and a nodule formed owing to a division part during sputtering using a plurality of long-sized cylindrical sputtering targets comprised of a plurality of division targets, and a method of manufacturing the same.SOLUTION: There is provided a cylindrical sputtering target 1 having a plurality of cylindrical division target materials 2a-2f joined together in parallel with an axial direction of a single backing tube 3. Among end faces 5a-5l of division target materials 2a-2f, end faces 5b-5k opposed to the end faces 5a-5l of other division target materials 2a-2f have an arithmetic average roughness Ra of 0.1 μm or larger and a 10-point average roughness Rz of 10.0 μm or smaller. Among the plurality of target materials 2a-2f, adjacent division targets have an interval of 0.1-1.0 mm between opposed end faces and a step of 1.0 mm or less between outer peripheral surfaces.
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Inventors:
OZAWA MAKOTO
ANDO ISAO
ANDO ISAO
Application Number:
JP2014063834A
Publication Date:
October 22, 2015
Filing Date:
March 26, 2014
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C23C14/34
Domestic Patent References:
| JP2000345326A | 2000-12-12 | |||
| JP2010100930A | 2010-05-06 | |||
| JPH1161395A | 1999-03-05 |
Attorney, Agent or Firm:
Kiwa Patent Office
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