Title:
ダンパ装置
Document Type and Number:
Japanese Patent JP6714420
Kind Code:
B2
Abstract:
A damper device includes a retaining plate, a plurality of first spring members and an output plate. The retaining plate has an annular shape. The plurality of first spring members are held by the retaining plate. The output plate is elastically coupled to the retaining plate through the plurality of first spring members. The retaining plate is circumferentially divided into a plurality of divided retaining plate pieces.
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Inventors:
Shotaro Nakatani
Application Number:
JP2016081686A
Publication Date:
June 24, 2020
Filing Date:
April 15, 2016
Export Citation:
Assignee:
EXEDY Friction Material Co.,Ltd.
International Classes:
F16F15/123; F16H45/02
Domestic Patent References:
| JP63128359U | ||||
| JP2002323111A | ||||
| JP9079344A | ||||
| JP2097754A | ||||
| JP2014202328A |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation