Title:
ダンパマウント取付構造
Document Type and Number:
Japanese Patent JP7122222
Kind Code:
B2
Abstract:
To provide a damper mount attachment structure which achieves improvement of positioning accuracy to achieve good assemblability.SOLUTION: A damper mount attachment structure includes a damper mount 10 which fixes an upper part 3a of a suspension device 3 to an attachment opening 6 at a vehicle body 1 side. The damper mount 10 comprises: a housing part 11 attached to the upper part 3a of the suspension device 3; a stay part 15 which is provided protruding from an outer peripheral surface 11a of the housing part 11 and contacts with a rear surface side 6a of a peripheral edge part of the attachment opening 6 in a state that the housing part 11 is inserted into the attachment opening 6 to attach the housing part 11 to a peripheral edge of the attachment opening 6; and a first rib 21, a second rib 22, and a third rib 23 which connect the stay part 15 with the outer peripheral surface 11a of the housing part 11. The first rib 21, the second rib 22, and the third rib 23 have side surfaces 21a, 22a, 23a facing an inner peripheral surface 6b of the attachment opening 6.SELECTED DRAWING: Figure 1
Inventors:
Tomoaki Kubota
Yasufumi Nakajima
Takashi Okazaki
Yasufumi Nakajima
Takashi Okazaki
Application Number:
JP2018204213A
Publication Date:
August 19, 2022
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B60G15/07
Domestic Patent References:
| JP3108511U | ||||
| JP2001193781A | ||||
| JP2001063332A |
Foreign References:
| EP2110273A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Isono International Patent and Trademark Office