Title:
平面を備えた減衰制御式キャピラリ
Document Type and Number:
Japanese Patent JP2004531897
Kind Code:
A
Abstract:
A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second cylindrical section with a substantially uniform second diameter less than the first diameter. The second cylindrical section is coupled to an end of the first cylindrical section and has a planar area along at least a portion of a length of the second section.
Inventors:
Amir Miller
Gil pearlberg
Gil pearlberg
Application Number:
JP2003506681A
Publication Date:
October 14, 2004
Filing Date:
May 08, 2002
Export Citation:
Assignee:
KULICKE & SOFFA INVESTMENTS, INC.
International Classes:
H01L21/60; B23K20/00; B23K20/10; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Osamu Kawamiya
Masahiro Ishino
Masahiro Ishino