Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
D.C. BONBARDMENT DEVICE AND MANUFACTURE OF FILM EL ELEMENT
Document Type and Number:
Japanese Patent JPH01304691
Kind Code:
A
Abstract:

PURPOSE: To perform the evaporation of phosphor film continuously by providing a heater in an electrode for high voltage and restraining a film adhered on the high voltage electrode.

CONSTITUTION: A stripe electrode 14 made of In2O3 film in which Sn is added is provided on a glass substrate 13, and Sr(TixZr1-x)O3 layer 15 is formed on it at 400°C of substrate temperature. A valve 16 is opened to introduce N2 untill 0.5Pa, voltage from a controlling unit 19 is applied to a high voltage electrode 18 having a heater in it, and N ion is formed between the layer 15 and the substrate 13 so as to clean the substrate 13. Next, the high voltage electrode 18 is heated to 300°C by a power supply 20 and a chamber 10 is maintained in high vacuum. The pellet 21 is evaporated in ZnS:M by an electronic beam 22, and an EL luminous layer 23 of ZnS:M is piled on the layer 15. After opening the valve 16, introducing N2, cleaning by N ion, processing under high vacuum condition at 500°C for 1 hour, a BaTa2O6 sintered compact layer 24 is sputtered at 100°C of substrate temperature so as to form an Al electrode 25 transverse to the electrode 14. With this constitution, normal EL element can be obtained without peeling between constitution films and without adhesion of film on the electrode during the evaporation.


Inventors:
NISHIKAWA MASAHIRO
KUWATA JUN
ABE ATSUSHI
Application Number:
JP13328588A
Publication Date:
December 08, 1989
Filing Date:
May 31, 1988
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05B33/10; (IPC1-7): H05B33/10
Attorney, Agent or Firm:
Toshio Nakao (1 outside)



 
Previous Patent: SEALING METHOD FOR PANEL

Next Patent: FILM EL ELEMENT