DECORATING MOLDING METHOD FOR THERMOPLASTIC RESIN MOLDING

Japanese Patent JP3479757

B2

PROBLEM TO BE SOLVED: To easily provide a molding whose protective layer has sufficient physical properties without performing after-coating by adding a photopolymerization initiator to an acrylic copolymer and a compound having a (meth)acryloyl group at a specific ratio to produce a photopolymerizable resin composition.
SOLUTION: A photopo1ymerizable resin composition forming a protective layer consists of 40-60 pts.wt. acrylic copolymer, 60-60 pts.wt. compound (wherein, an acrylic copolymer is removed.) having (meth)acryloyl groups of at least three pieces in a molecule and a photopolymerization initiator. In the acrylic copolymer, a (meth)acryloyl group is introduced into the glycidyl group of a side chain and the (meth)acryloyl group of at least one piece is contained in a molecule and glass transition temperature of a main chain is 40-120°C and weight-average molecular weight is 10,000-200,000. Then, a flexible decorating film 25 in which the compoairion is applied and dried to form a protective layer 21 is set in a mold and a thermoplastic material is injected and molded. The surface of a molding is irradiated with ultraviolet rays to cure the protective layer 21.

Ryoichi Takada
Hiroshi Watarai
Toshimichi Kawata
Ikeda
Takashi Mita

JP21754295A

December 15, 2003

August 25, 1995

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Toyoda Gosei Co., Ltd.
Mitsubishi Rayon Co., Ltd.

B29C35/08; B29C35/02; B29C45/16; B32B27/30; C08F2/50; C09D4/06; B29K33/00; B29K101/12; B29K105/24; B29L9/00; B60R13/02; B60R13/04; (IPC1-7): B29C45/16; B29C35/08

JP584772A

Kentaro Iida (1 person outside)

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