Title:
DECORATIVE MULTI-LAYER SURFACING MATERIALS HAVING EMBEDDED CONDUCTIVE MATERIALS, SOLID SURFACES MADE THEREWITH, METHODS FOR MAKING SUCH SURFACING MATERIALS AND USES THEREFOR
Document Type and Number:
Japanese Patent JP2021020471
Kind Code:
A
Abstract:
To provide decorative, durable, functional, surfacing materials capable of accomplishing wireless power transmission to numerous devices at the same time, a surface made using the surfacing material, a method for making the surface, a method for transmitting wireless power using the surfacing material.SOLUTION: There is provided a decorative multi-layer 1 surfacing material comprising: a first resin-impregnated paper layer 10 and a second resin-impregnated paper layer 20, and a first conductive material 50 having a first terminus 51 and a second terminus 52 and capable of carrying an electric current from the first terminus to the second terminus; wherein the first conductive material is disposed on a first surface of the first resin-impregnated paper layer; wherein the first resin-impregnated paper layer and the second resin-impregnated paper layer are disposed in a stacked and compressed relationship such that the first conductive material is encapsulated between the first resin-impregnated paper layer and the second resin-impregnated paper layer; and wherein at least one of the first resin-impregnated paper layer, the second resin-impregnated paper layer or an optional additional resin-impregnated paper layer is a decorative layer.SELECTED DRAWING: Figure 1a
Inventors:
KEVIN FRANCIS O'BRIEN
BRYCE LAMAR COLE
ROBERT JACOB KRAMER
BRYCE LAMAR COLE
ROBERT JACOB KRAMER
Application Number:
JP2020180309A
Publication Date:
February 18, 2021
Filing Date:
October 28, 2020
Export Citation:
Assignee:
DILLER CORP THE
International Classes:
B32B33/00; B32B7/025; B32B27/00; B32B27/04; B32B27/10; B32B27/18; B32B27/42; H02J50/10; H02J50/40
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Foreign References:
| DE202014003058U1 | 2014-05-06 | |||
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| US20140292103A1 | 2014-10-02 | |||
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Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes