Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3203209
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To avoid deteriorating a semiconductor element below bonding pads, by providing bridge across an opening formed at an island, and wire-bonding thin metal wires by the ball-bonding for connection on the semiconductor chip side and stitch-bonding for connection on the bridge side.
SOLUTION: An island between semiconductor chips 50, 51 has an opening 56 across which required no. of island-like bridges 57 are provided and wire- bonded to bonding pads 53 through thin metal wires, such that the pads 53 at the semiconductor chips 50, 51 are ball-bonded and those at the bridges 57 are stitch-bonded. This suppresses the stress exerted on the chips 50, 51 below the pads 53 and hence suppresses the deterioration of the semiconductor elements below the pads 53.
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Inventors:
Prince Ochiai
Makoto Tsubonotani
Kazumi Onda
Makoto Tsubonotani
Kazumi Onda
Application Number:
JP19756697A
Publication Date:
August 27, 2001
Filing Date:
July 23, 1997
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
International Classes:
H01L25/18; H01L25/04; (IPC1-7): H01L25/04; H01L25/18
Domestic Patent References:
| JP750384A | ||||
| JP8264596A |
Attorney, Agent or Firm:
Masamasa Shibano