Title:
DEFECT CORRECTION DEVICE, DEFECT CORRECTION METHOD, AND PATTERN SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2009258229
Kind Code:
A
Abstract:
To provide a pattern substrate defect correction method and device to reliably correct a defect, and to provide a pattern substrate manufacturing method.
The defect correction device includes a transfer film 18 which has a transfer layer transferred to a pixel boundary part and is oppositely arranged on a substrate 6, and an application needle 27 which corrects the pixel contacting the pixel boundary part of which transfer layer is transferred from the transfer film 18 by a correction fluid 29 corresponding to the pixel.
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Inventors:
ISHIKAWA TAKUJI
YAMAZAKI TERUAKI
YAMAZAKI TERUAKI
Application Number:
JP2008104773A
Publication Date:
November 05, 2009
Filing Date:
April 14, 2008
Export Citation:
Assignee:
LASERTEC CORP
International Classes:
G02B5/20; G02F1/13; G02F1/1335
Attorney, Agent or Firm:
Ken Ieiri
Yasuhiro Iwase
Yasuhiro Iwase
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