To provide a defect inspection device enabled in the accurate grasp of a subject of a defect by uniformly detecting even the defect extending in any direction without relying on the direction of the defect in the case that the elongated defect is present on the surface of wafer.

The defect inspection device is equipped with at least an incident system for irradiating the surface of the wafer with a laser beam while scanning the surface of the wafer and a light receiving system having a light receiver arranged so as to capture scattered light scattered at a definite angle from the defect of the wafer. The incident system is constituted so that one laser beam emitted from a light source is branched into a plurality of laser beams to make the branched laser beams incident on the same region of the surface of the wafer from a plurality of directions, wherein the light receiving system is constituted of a system for capturing the scattered light by one light receiver.