Title:
欠陥検査方法および欠陥検査装置
Document Type and Number:
Japanese Patent JP3745564
Kind Code:
B2
Abstract:
Transforming optical images of a portion including a normal conductor pattern having a surface roughness, a portion subjected to an inspection, and a reference portion to images of electric charges and picking up these as electric signals by an image pick-up device, rendering the optical image including the normal conductor pattern having the surface roughness to a pixel signal by the image pick-up device, controlling a light volume of the optical image so that the pixel signal is saturated or immediately before the saturation, picking up a pixel signal of the portion to be inspected under this light volume, obtaining a differential signal from a pixel signal picked up from the reference portion, and judging an existence of defect from the differential signal, so as to detect defects such as a hiatus of conductor, a short circuit, and a deposition of an extraneous matter on a wafer, on which the normal conductor pattern having the roughened surface, with a high accuracy in processes of forming films and etching in manufacturing a semiconductor device.
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Inventors:
Ayumu Onoyama
Kouichi Sakurai
Kazuhiro Oka
Hiroyuki Ishii
Katsuhiro Fujiyoshi
Kouichi Sakurai
Kazuhiro Oka
Hiroyuki Ishii
Katsuhiro Fujiyoshi
Application Number:
JP19432199A
Publication Date:
February 15, 2006
Filing Date:
July 08, 1999
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
G01N21/88; G06T1/00; G01N21/94; G01N21/956; G06T7/00; H01L21/66
Domestic Patent References:
| JP2134510A | ||||
| JP8210820A | ||||
| JP6249791A |
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
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