Title:
DEFECT INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2015184023
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a defect inspection method having improved an accuracy of the detection and classification of a defect.SOLUTION: In one embodiment, there is provided a defect inspection method in which an inspection object is inspected; the inspection object is classified by a feature amount of a signal in the inspection of the inspection object; an in-plane map of the inspection object is generated based on the feature amount of the signal in the inspection of the inspection object; the feature amount of the in-plane map of the inspection object is calculated; and a defect of the inspection object is classified by a concordance rate of the feature amount of the in-plane map of the inspection object and the feature amount of the in-plane map of a reference object. The inspection object and the reference object are the region within a semiconductor wafer, and the feature amount of the in-plane map includes: a generation rate within an outer periphery calculated by a radial average from a center of the semiconductor wafer, a generation rate within an inner periphery calculated by the radial average from the center of the semiconductor wafer, or a generation rate of a specific region in the case of dividing the region of the semiconductor wafer.
Inventors:
YOKOCHI KAITO
IIDA YUSUKE
IIDA YUSUKE
Application Number:
JP2014057892A
Publication Date:
October 22, 2015
Filing Date:
March 20, 2014
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G01N21/956; H01L21/66
Attorney, Agent or Firm:
Masahiko Hinataji
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