Title:
DEFECT OBSERVATION METHOD, APPARATUS, AND PROGRAM
Document Type and Number:
Japanese Patent JP2023109690
Kind Code:
A
Abstract:
To provide a defect observation method and a program therefor which can realize high accuracy in observing and detecting defect at an outer peripheral part and a bevel part of a sample.SOLUTION: The present invention is directed to a defect observation method carried out by a computer system. The method includes first step S1 of acquiring, as a bevel image, an image captured by a microscope or an imaging apparatus by setting a defect candidate coordinate in a bevel part, and second step S2 of detecting defect in the bevel image. Second step S2 includes step S606 for determining whether or not there is one part of a wafer edge, a wafer notch and an orientation flat in the bevel image, step S607 of, based on the determination result, selectively applying a defect detection method of detecting the defect from the bevel image by switching the method from a plurality of methods as candidates, and step S608 of carrying out processing for detecting the defect from the bevel image with the switched method.SELECTED DRAWING: Figure 6
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Inventors:
KONDO NAOAKI
DOI YUKI
MIYAMOTO ATSUSHI
NAKAYAMA HIDEKI
KIZUKI HIROHIKO
DOI YUKI
MIYAMOTO ATSUSHI
NAKAYAMA HIDEKI
KIZUKI HIROHIKO
Application Number:
JP2022173347A
Publication Date:
August 08, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
G06T7/00; G01N23/2251; H01L21/66
Attorney, Agent or Firm:
Patent Attorney Tsutsui International Patent Office