Title:
DEPOSITION APPARATUS AND DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2023097530
Kind Code:
A
Abstract:
To provide a deposition apparatus and a deposition method that can suppress evaporation of a plating solution adhered to a polymer electrolyte.SOLUTION: A deposition apparatus 1 is an apparatus for depositing a metallic film derived from metallic ions in a plating solution onto the surface of a substrate 12 by applying voltage in a state in which a polymer electrolyte 13 is in contact with a substrate 12. The deposition apparatus 1 comprises: a container moving device 18 for moving a container 14 so as to become one state of a deposition state in which the polymer electrolyte 13 performs a deposition in contact with the substrate 12 and a non-deposition state in which the polymer electrolyte 13 is detached from the substrate 12 to the other state; a heater 22 for heating the plating solution; and a polymer electrolyte moving device 23 for, in the non-deposition state, moving the polymer electrolyte 13 so as to be detached from the substrate 12 or to again cover an opening part 141 of the container 14.SELECTED DRAWING: Figure 2
More Like This:
| JPH0741995 | STATIONARY PLATING DEVICE |
| JPS5811519 | [Title of the Invention] Plating device |
Inventors:
KURODA KEIJI
KONDO HARUKI
OKAMOTO KAZUAKI
INAGAKI KOJI
YANAGIMOTO HIROSHI
MORI RENTARO
KONDO HARUKI
OKAMOTO KAZUAKI
INAGAKI KOJI
YANAGIMOTO HIROSHI
MORI RENTARO
Application Number:
JP2021213696A
Publication Date:
July 10, 2023
Filing Date:
December 28, 2021
Export Citation:
Assignee:
TOYOTA MOTOR CORP
International Classes:
C25D17/00; C25D17/06; C25D21/02
Attorney, Agent or Firm:
Patent Attorney Corporation Hiraki International Patent Office