Title:
FILM DEPOSITION EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023027494
Kind Code:
A
Abstract:
To heat mist more efficiently in film deposition equipment that uses mist.SOLUTION: Film deposition equipment comprises: a stage on which a substrate is placed; a heater that heats the substrate; a mist supply source that supplies mist of a solution of film material dissolved in a solvent; a superheated steam supply source that supplies superheated steam of the same material as the solvent; and a delivery device that delivers the mist and superheated steam toward the surface of the substrate. The equipment makes a film containing the film material grow on the surface of the substrate.SELECTED DRAWING: Figure 1
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Inventors:
NAGAOKA TATSUJI
NISHINAKA HIROYUKI
YOSHIMOTO MASAHIRO
NISHINAKA HIROYUKI
YOSHIMOTO MASAHIRO
Application Number:
JP2021132611A
Publication Date:
March 02, 2023
Filing Date:
August 17, 2021
Export Citation:
Assignee:
DENSO CORP
TOYOTA MOTOR CORP
MIRISE TECH CORP
KYOTO INST TECH
TOYOTA MOTOR CORP
MIRISE TECH CORP
KYOTO INST TECH
International Classes:
H01L21/31; C23C16/455; C30B25/14; C30B29/16; H01L21/363; H01L21/365
Attorney, Agent or Firm:
Patent Attorney Corporation Kaiyu International Patent Office
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