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Title:
DEPOSITION DEVICE
Document Type and Number:
Japanese Patent JP2015142038
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for enhancing the film quality, while enhancing the deposition speed for a substrate.SOLUTION: A deposition device is constituted to include a turntable arranged in a vacuum vessel and revolving a substrate mounted in a mounting region provided on one side thereof, a process gas supply section for supplying process gas, having a thermal decomposition temperature of 520°C or more under 1 atm, to the substrate, and a heating section for heating the turntable so as to perform deposition by heating the substrate to 600°C or more. The process gas supply section includes a gas shower head having a plurality of process gas discharge holes provided to face the passage region of the substrate, and a cooling mechanism for cooling a portion of the gas shower head facing the passage region down to a temperature lower than the thermal decomposition temperature of the process gas.

Inventors:
ONO YUJI
TACHIBANA MITSUHIRO
HONMA MANABU
Application Number:
JP2014014575A
Publication Date:
August 03, 2015
Filing Date:
January 29, 2014
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/31; H01L21/316
Domestic Patent References:
JP2013172153A2013-09-02
JP2012023221A2012-02-02
JP2004288903A2004-10-14
JP2012079919A2012-04-19
JP2009512188A2009-03-19
JP2012525708A2012-10-22
JP2011222960A2011-11-04
JP2013172153A2013-09-02
JP2012023221A2012-02-02
JP2004288903A2004-10-14
Attorney, Agent or Firm:
Toshio Inoue
Tomoaki Miida



 
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