Title:
DEPOSITION METHOD FOR GOLD WIRING
Document Type and Number:
Japanese Patent JP2003268588
Kind Code:
A
Abstract:
To provide a deposition method by which a wiring can be formed without annealing after plating.
In the deposition method for a gold wiring where a plated gold wiring of ≥1 μm film thickness is deposited by electroplating, plating is performed at a low current density so that self anneal of the resultant plated gold wiring can be finished practically in a day.
Inventors:
SUGITANI SUEHIRO
ENOKI TAKATOMO
ENOKI TAKATOMO
Application Number:
JP2002066674A
Publication Date:
September 25, 2003
Filing Date:
March 12, 2002
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
C25D5/02; C25D5/50; C25D7/00; C25D7/12; H01L21/288; H01L21/3205; (IPC1-7): C25D5/02; C25D5/50; C25D7/00; C25D7/12; H01L21/288; H01L21/3205
Attorney, Agent or Firm:
Amamiya Masaki