Title:
【発明の名称】コンプライアントで架橋性の熱インタフェース材料
Document Type and Number:
Japanese Patent JP2003509574
Kind Code:
A
Abstract:
Described is a compliant and crosslinkable thermal interface material of at least one malenized rubber with maleic anhydride adducted to the molecule and at least one hydroxyl terminated olefin rubbers, and a method of making and using same; as well as a method of improving thermal conductivity of polymer systems.
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Inventors:
Nguyen, Mi
Grand Day, The Ames
Grand Day, The Ames
Application Number:
JP2001524111A
Publication Date:
March 11, 2003
Filing Date:
September 14, 2000
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
C08J5/18; B23K35/02; C08F279/00; C08F279/02; C08K3/00; C08K3/08; C08K9/02; C08L13/00; C08L15/00; C08L51/04; B23K35/26; B23K35/36; (IPC1-7): C08L13/00; C08J5/18; C08K3/00; C08L15/00
Domestic Patent References:
JPS6280911A | 1987-04-14 | |||
JPH11209618A | 1999-08-03 | |||
JPH10237228A | 1998-09-08 | |||
JPH09283955A | 1997-10-31 | |||
JPH02160885A | 1990-06-20 | |||
JPH0216135A | 1990-01-19 | |||
JPS6280911A | 1987-04-14 | |||
JPH11209618A | 1999-08-03 | |||
JPH10237228A | 1998-09-08 | |||
JPH09283955A | 1997-10-31 | |||
JPH02160885A | 1990-06-20 | |||
JPH0216135A | 1990-01-19 |
Attorney, Agent or Firm:
Yoshio Kawaguchi (5 outside)