PURPOSE: To inexpensively provide a printed circuit board where components can be mounted with a plurality of protuberances on one copper foil land.

CONSTITUTION: A slit 2a is formed in nearly cross shape from the center of each side to a center in an etching stage at a rectangular copper foil land 2 of a printed circuit board 1. A solder protuberance 4 protrudes and is formed from each slit 2a so that the solder protuberance 4 may be divided into four parts. When the protuberance tops of the four semiconductor protuberances 4a, 4a, 4a, and 4a are connected, a plane is nearly formed. Therefore, when mounting chip components to the solder protuberance 4 of the printed circuit board 1 by the reflow soldering method, the chip components can be mounted easily on each solder protuberance 4a, thus improving soldering accuracy.