【発明の名称】接合部材の硬化を促進する追従性ループ式誘導加熱装置および方法

Title:

【発明の名称】接合部材の硬化を促進する追従性ループ式誘導加熱装置および方法

Document Type and Number:

Japanese Patent JP2003512709

Kind Code:

A

Abstract:

An induction heating apparatus and method for heating a substantially continuous first bondline defined by a length of thermally responsive bonding material positioned between a first member and a second member. The first member or second member is made of an electrically conductive material or positioned adjacent an electrically conductive material. The inductive heating apparatus includes a flexible, reshapeable cable assembly operably positionable adjacent the first member along the first bondline. The flexible, reshapeable cable assembly is capable of being manually shaped to a first shape of the first bondline, and is capable of being manually re-shaped to a second shape of a second bondline different than the first shape of the first bondline. An alternating current power supply is electrically coupled to the flexible, reshapeable cable assembly. When the alternating current power supply is activated the reshapeable cable assembly operates to inductively heat the electrically conductive material for conductive heating of the thermally responsive bonding material substantially uniformly along the first bondline.

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