Title:
【発明の名称】熱緩和性基材およびアレイ
Document Type and Number:
Japanese Patent JP2003516527
Kind Code:
A
Abstract:
Articles, such as high density arrays, on heat-relaxable substrates that can be relaxed by exposure to thermal energy are disclosed, along with methods of manufacturing the arrays, and systems/apparatus for relaxing arrays using electromagnetic energy. The arrays may themselves include electromagnetic energy sensitive material in their construction, in which case exposure of the arrays to suitable electromagnetic energy can provide the thermal energy required to cause the arrays to relax. In other embodiments, the arrays may not include an electromagnetic energy sensitive material in their construction, in which case the arrays may be heated indirectly, i.e., by locating the arrays within a system or apparatus that includes an electromagnetic energy sensitive material and transferring the thermal energy from the electromagnetic energy sensitive material to the array by, e.g., conduction.
Inventors:
Patil, Sanjay El.
Duane, Daniel Sea.
Halberson, Kurt Jay.
Leperet, Pierre H.
Duane, Daniel Sea.
Halberson, Kurt Jay.
Leperet, Pierre H.
Application Number:
JP2001543253A
Publication Date:
May 13, 2003
Filing Date:
December 04, 2000
Export Citation:
Assignee:
3M Innovative Properties Company
International Classes:
G01N31/22; B01J19/00; B01J19/12; B29C61/02; B29C61/06; C12M1/00; C12M1/38; C12N15/09; G01N33/53; G01N33/566; G01N37/00; B29C35/02; B29C35/08; C40B40/06; C40B60/14; (IPC1-7): G01N33/53; B01J19/00; B01J19/12; C12M1/00; C12M1/38; C12N15/09; G01N31/22; G01N33/566; G01N37/00
Attorney, Agent or Firm:
Takashi Ishida (4 others)