PURPOSE: To obtain the measuring method for a semiconductor device, which can make electrical connection excellent and can maintain continuous stability, in the inspection of electric characteristics.

CONSTITUTION: High-pressure air is blown on a measuring head 1, which inspects the electric characteristics of a semiconductor device 2, with a high- pressure air gun 3. Thus, the semiconductor device 2 and the peripheral part of the measuring head 1 for inspecting the electric characteristics are cleaned. The semiconductor device 2 is sucked with a semiconductor-device setting jig 4 and placed on the measuring head 1 for inspecting the electric characteristics. The semiconductor device 2 is pushed with the semiconductor-device setting jig 4. The semiconductor-device setting jig 4 is vibrated. Thus, the surfaces of a contact pin 5 and a lead pin 6 of the semiconductor device are polished so as to obtain the excellent electric contact. Since the surfaces of the contact pin 5 and the lead pin 6 are polished and dust is generated around the measuring set, the high-pressure air is blown with the high-pressure air gun 3.