Title:
【発明の名称】時間-温度インジケータ付はんだペースト
Document Type and Number:
Japanese Patent JP2002528740
Kind Code:
A
Abstract:
A solder paste product includes solder paste in a container with a time-temperature indicator positioned to measure the solder paste's cumulative exposure to heat.
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Inventors:
Col Bryan M
Application Number:
JP2000579397A
Publication Date:
September 03, 2002
Filing Date:
October 28, 1999
Export Citation:
Assignee:
Manufacturers Services Limited
International Classes:
G01K11/12; B23K3/08; B23K35/00; B23K35/02; B23K35/14; G01K3/04; G01N31/22; H05K3/34; (IPC1-7): G01K11/12; B23K35/14
Attorney, Agent or Firm:
Shuji Sugimoto (2 outside)