Title:
【発明の名称】サブストレートを処理する方法並びに装置
Document Type and Number:
Japanese Patent JP3299980
Kind Code:
B2
Abstract:
In a method for treating substrates, the substrates are lowered for treatment into a treatment fluid contained in a treatment device. The substrates are then lifted by a first receiving device at least partially out of the treatment fluid and transferred to a second receiving device for completely lifting the substrates out of the treatment fluid. The second receiving device is completely dry at the time of transfer. The drops forming at the lowest point of the substrates are drained during lifting by a drop draining element. The device for performing the method has a lifting device with a first and second receiving device and a drop draining device for draining the drops forming at the lowest point of the substrates during lifting of the substrates from the treatment fluid.
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Inventors:
Dietmar Shane Laver
Application Number:
JP51617698A
Publication Date:
July 08, 2002
Filing Date:
September 16, 1997
Export Citation:
Assignee:
Steerg Micro-Tech Gezel Shaft Mitt Beschlenktel Haftung
International Classes:
B08B3/04; B65G49/07; F26B11/22; H01L21/00; G02F1/13; H01L21/304; (IPC1-7): B08B3/04; F26B11/22; G02F1/13; H01L21/304
Domestic Patent References:
| JP6455839A | ||||
| JP8148458A |
Other References:
【文献】米国特許4722752(US,A)
Attorney, Agent or Firm:
Toshio Yano (3 outside)