Title:
【発明の名称】半導体装置の製造方法、及び半導体装置
Document Type and Number:
Japanese Patent JP3376348
Kind Code:
B2
Inventors:
Akira Mitsuo
Application Number:
JP2000320160A
Publication Date:
February 10, 2003
Filing Date:
October 20, 2000
Export Citation:
Assignee:
Semiconductor Leading Edge Technologies, Inc.
International Classes:
H01L21/302; H01L21/3065; (IPC1-7): H01L21/3065
Domestic Patent References:
| JP7211772A | ||||
| JP5190509A | ||||
| JP5326456A | ||||
| JP6126239A | ||||
| JP2000502512A |
Attorney, Agent or Firm:
Mamoru Takada (2 outside)